| Affiliation: | 1. IMS, CNRS UMR 5818, Université Bordeaux 1-351, Cours de la Libération, F-33405 Talence, France;2. III-V Lab, Joint Lab: Bell Labs, Thales Research and Technology and CEA-LETI, Route de Nozay, F-91461 Marcoussis Cedex, France;1. Key Laboratory of Advanced Technique & Preparation for Renewable Energy Materials, Ministry of Education, Yunnan Normal University, Kunming 650500, China;2. Institute of Materials Science and Engineering, Ocean University of China, Qingdao 266100, China;1. Chair for Electron Devices and Integrated Circuits, TU Dresden, 01062 Dresden, Germany;2. Dept. of Electrical and Computer Engineering, UC San Diego, La Jolla, CA, USA;1. School of Information Science and Technology, Key Laboratory of Polar Materials and Devices, East China Normal University, Shanghai, 200241, China;2. Tsinghua National Laboratory for Information and Technology, Institute of Microelectronics, Tsinghua University, Beijing 100084, China;1. Laboratoire Matériaux, Molécules et Applications, Institut Préparatoire aux Études Scientifiques et Techniques, Université de Carthage, BP 51, 2070 La Marsa, Tunis, Tunisia;2. Sorbonne Universités, UPMC Université Paris 06, UMR 7588, Institut des NanoSciences de Paris, F-75005 Paris, France;3. CNRS, UMR 7588, INSP, F-75005 Paris, France;4. Laboratoire de Photonique et Nanostructures, CNRS, UPR 20, Route de Nozay, F-91460 Marcoussis, France |
