第一顺序键合引脚失效分析及键合可靠性提高

文章分析了一例采用金丝热超声键合电路在工艺监控过程中的键合强度检测合格，在高温稳定性烘焙后其引线抗拉强度同样符合MIL-STD-883G方法2011．7的要求，但电路在使用中出现第一顺序键合引脚开路现象。经分析是由于芯片键合区（压点）的材料、结构、键合工艺参数处于工艺下界，以及此类缺陷不能通过键合引线抗拉强度在线监测（包括125℃下的24h高温贮存后的检测）检测出而导致。最后针对缺陷所在，通过改进检测方法、键合工艺设置等消除了键合缺陷，并提高了键合可靠性。

Failure Analysis of the First Wire's Bond and Improvement of its' Bonding Reliability

During the bonding process of Au wire thermosonic bonding,the result of the bond strength was according with the technology require. The minimum bond strength was in accordance with the MIL-STD-883G Method 2011.7 after high temperature stability baking. But the first wire’s bond peeled when the circuit was in using. This phenomenon is analyzed in this article,the reason is that the die bond area (PAD) material,structure and bonding technology parameters were out of the technological limits. And the defect could not be detected during the test of the bonding wire tensile strength(including the test after stored in the condition of 125℃ and 24 h). Finally,bonding defect was avoided by improving on the test method and bonding technological parameters,and the bonding reliability is improved.