| 端羟基聚丁二烯改性氰酸酯体系固化反应动力学 |
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| 引用本文： | 王薇薇,王瑞,刘靖,胡柏星.端羟基聚丁二烯改性氰酸酯体系固化反应动力学[J].热固性树脂,2011(5):21-24. |
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| 作者姓名： | 王薇薇 王瑞 刘靖 胡柏星 |
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| 作者单位： | 南京大学化学化工学院; |
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| 摘 要： | 采用示差扫描量热法(DSC)研究了端羟基聚丁二烯(HTPB)改性双酚A型氰酸酯树脂(BADCy)体系的固化反应动力学,根据Arrhenius方程对固化过程动力学参数进行了求解,建立了固化反应动力学模型。结果表明,随着HTPB含量的增大,动态DSC固化反应放热峰向低温方向移动,说明HTPB可以催化固化反应并降低体系的反应温度。纯BADCy和BADCy/15%HTPB体系等温固化符合自催化反应模型。纯BADCy体系以及BADCy/15%HTPB体系的表观反应活化能分别为59.67 kJ/mol、56.91 kJ/mol。
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| 关 键 词： | 双酚A型氰酸酯树脂 端羟基聚丁二烯 改性 固化反应动力学 |
Curing kinetics of hydroxyl-terminated polybutadiene modified cyanate ester resin |
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| WANG Wei-wei,WANG rui,LIU jing,HU Bai-xing.Curing kinetics of hydroxyl-terminated polybutadiene modified cyanate ester resin[J].Thermosetting Resin,2011(5):21-24. |
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| Authors: | WANG Wei-wei WANG rui LIU jing HU Bai-xing |
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| Affiliation: | WANG Wei-wei,WANG rui,LIU jing,HU Bai-xing(School of Chemistry and Chemical Engineering,Nanjing University,Nanjing 210093,China) |
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| Abstract: | The curing kinetics of HTPB modified bisphenol A cyanate ester resin was studied by DSC.The curing reaction kinetic parameters were obtained arrording to Arrhenius equation.The curing kinetic model of cyanate ester system was established.The results showed that exothermic peaks moved to the lower temperatures with the increasing of HTPB contents which indicated the curing reaction could be catalyzed and the reaction temperature could be reduced by HTPB.The isothermal curing of the pure BADCy and its blend w... |
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| Keywords: | bisphenol A cyanate ester resin(BADCy) hydroxyl-terminated polybutadiene(HTPB) modification curing kinetics |
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