电解铜箔无砷粗化处理工艺改进探讨

为减小现有电解铜箔粗化工艺中含砷添加剂的使用,通过调整18μm和35μm电解铜箔现有粗化工艺流程和表面处理工艺参数,分析了改进后工艺流程和表面处理工艺参数对粗化层表面性能和微观组织的影响。结果表明:当粗化液中Cu2+浓度为5 g/L~30 g/L,H2SO4浓度为40 g/L~60 g/L,温度在15℃~45℃,电流密度在1300 A/m2~2100 A/m2时,铜箔的抗剥离强度较工艺改进前的稍有增加,达到了电解铜箔的性能要求。微观形貌观察表明,采用新粗化处理工艺制备的电解铜箔表层晶粒与原工艺制备的电解铜箔的晶粒度相同,达到了预期的粗化效果。

THE RESEARCH OF PROCESS IMPROVEMENT ON ROUGHENED TREATMENT PROCESS OF ELECTROLYTIC COPPER FOIL WITHOUT ARSENIC

This paper studies the effect of process routes and process parameters on coarsening layer surface by investi- gating the the 18 μm and 35μm electrolytic copper foil production to find a new route replacing the arsenic additives in the existing coarsening technology of copper foil. The influence of the improved process route and process parameters of surface treatment on the surface properties and microstructure of the coarsening layer was researched. The results show that the peel resistance strength of the electrolytic copper foil was slightly improved than the former process when the parameters as follows ： Cu^2＋ 5 g/L-30 g/L, H2SO4 40 g/L-60 g/L, temperature 15 ℃ -45 ℃, current density 1300 A/m^2 -2100 A/m^2. The SEM shows that the grain size of the electrolytie copper foil prepared by the new process route could be comparable to those by old process and the eoarsening results well meet the expectations.