| La对Sn3.5Ag0.5Cu钎料界面组织和性能的影响 |
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| 引用本文： | 吴敏.La对Sn3.5Ag0.5Cu钎料界面组织和性能的影响[J].电子元件与材料,2008,27(11). |
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| 作者姓名： | 吴敏 |
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| 作者单位： | 辽宁石油化工大学,机械工程学院,辽宁,抚顺,113001 |
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| 摘 要： | 通过SEM和EDAX等,研究了La添加量对Sn3.5Ag0.5Cu钎料与Cu基体焊合界面IMC微观组织及性能的影响。结果表明:添加不同量的La均对Sn3.5Ag0.5Cu与Cu基体焊合后的组织有细化作用并增强其力学性能。其中以w(La)达到0.05%时最优,剪切强度可提高10.7%。材料热力学理论计算结果表明,La具有"亲Sn"倾向,添加少量La到Sn3.5Ag0.5Cu钎料中,可减小Cu6Sn5/Cu界面Sn的活度,降低IMC的长大驱动力。
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| 关 键 词： | 金属材料 Sn3.5Ag0.5Cu钎料 La 界面金属间化合物 |
Effect of La on interface structure and property for Sn3.5Ag0.5Cu solder |
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| WU Min.Effect of La on interface structure and property for Sn3.5Ag0.5Cu solder[J].Electronic Components & Materials,2008,27(11). |
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| Authors: | WU Min |
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| Affiliation: | WU Min (School of Mechanical Engineering,Liaoning Shihua University,Fushun 113001,Liaoning Province,China) |
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| Abstract: | Effect of La on microstructure and property of IMC between Sn3.5Ag0.5Cu solder and Cu substrate was researched by adding various amount of La in to the solder by means of SEM、EDAX and so on. The results show that La can remarkably refine the microstructure of IMC between solder and Cu substrate, and enhance its mechanical property. Especially, w(La) of 0.05% is optimal, the shear strength increases by 10.7%. The material thermodynamic calculating results show that La has affinity tendency for Sn, the activity of Sn on the interface of Cu6Sn5/Cu and driving force for IMC growth decrease by adding small amount of La in Sn3.5Ag0.5Cu solder. |
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| Keywords: | La |
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