| Al2O3 陶瓷与Al低温连接工艺研究 |
| |
| 引用本文： | 梁旭文,冯吉才,董占贵.Al2O3 陶瓷与Al低温连接工艺研究[J].焊接,2000(10):9-12. |
| |
| 作者姓名： | 梁旭文 冯吉才 董占贵 |
| |
| 作者单位： | [1]中国科学院上海冶金所 [2]哈尔滨工业大学 |
| |
| 摘 要： | 采用共晶烧结工艺对Ａｌ２Ｏ３陶瓷进行表面Ｃｕ金属化，并采用乔探钎焊的办法实现了陶瓷与Ａｌ的低熳连接。实验结果表明，钎料与Ａｌ基体和金属化层之间均有良好的冶金作用，能够保证接头的强度，而且钎焊过程不会对金属化层／陶瓷界面造成不良影响。
|
| 关 键 词： | 低温连接 陶瓷表面金属化 刮控钎焊 铝 |
LOW TEMPERATURE BONDING OF ALUMINA CERAMIC TO Al |
| |
| Liang Xuwen
Feng Jicai
,Dong Zhangui
,Wang Dayong
,Shen Zhitong.LOW TEMPERATURE BONDING OF ALUMINA CERAMIC TO Al[J].Welding & Joining,2000(10):9-12. |
| |
| Authors: | Liang Xuwen
Feng Jicai Dong Zhangui Wang Dayong Shen Zhitong |
| |
| Affiliation: | Liang Xuwen
(The Institute of Metallurgy of CSA)Feng Jicai
,Dong Zhangui
,Wang Dayong
,Shen Zhitong
(Harbin Institute of Technology) |
| |
| Abstract: | Cu metalliaxtion of alumina ceramic surface was completed by eutectic sintered process.And, the metallized alumina was bonded to Al at low temperature using scrape-brazing process.The test result showed that the brazing filler metal had better action to Al and metallization layer ,which could insure the strength of joint. In addition,the bionding process had not any bad influence on the interface between alumina and metallization layer. |
| |
| Keywords: | low temperature bonding metallization of ceramic surface scrape brazing |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
