固化促进剂种类对集成电路封装材料固化行为的影响

选用酚醛树脂为固化剂，分别以2-甲基咪唑和三苯基磷为固化促进剂，制备了集成电路封装用环氧树脂模塑料。用非等温差示扫描量热（DSC）法研究了固化促进剂种类对环氧模塑料的固化行为的影响，利用Kissinger方程、Crane方程和Ozawa方程计算出了环氧树脂模塑料的固化活化能、反应级数等固化反应动力学参数，推导出了固化过程的凝胶化温度、固化温度、后处理温度等最佳固化工艺条件。

Effect of Curing Accelerator Type on Curing Behavior of IC Packaging Materials

Epoxy molding compounds for integrated circuits (IC) packaging were prepared by using phenolic resin as a curing agent, either 2-methyl imidazole or triphenyl phosphine as a curing accelerator. The curing behavior of the compounds was investigated by non-isothermal DSC method. Based on Kissinger, Crane, and Ozawa methods, the kinetic parameters such as activation energy and reaction order of the curing reaction were obtained. The characteristic temperatures of the curing process such as gel temperature, curing temperature, and post curing temperature were calculated by extrapolation. It was found that the compound using 2-methyl imidazole had a lower activation energy compared with that using triphenyl phosphine.