芯片封装过程热超声制造界面多参数影响的规律与控制

在中国国家自然科学基金重大项目《先进电子制造中的重要科学技术问题研究》资助下，提出芯片封装界面制造过程多参数影响规律与控制之科学问题。获得包括界面键合结构与强度生成机制、超声作用下键合界面的运动行为、超声能输入系统动力学与超声能量传递模型等3个方面的研究成果。对上述成果提出研究报告。 为认识外能场对界面物质的作用机制，采用高分辨透射电镜(High Resolution Transmission Electron Microscopy，HRTEM)观察超声键合点(Bonding Interface，BI)连接界面微结构及生成条件，观察到超声作用界面材料位错密度剧增，表明界面没有发生高温，界面超声键合是在较低的温度下进行扩散键合，推断，超声键合过程中位错/表面扩散起重要作用。提出微观位错管道快速扩散成形机制——超声键合过程中激活的原子通过位错通道迅速达到表面和晶界

Multi-parameters Influence and Control in ThermosonicChip Packaging Interface Manufacturing

this research is funded by the Study on the Key Scientific and Technological Issues in the Process of Advanced Electronic Manufacturing of NSFC. The scientific problem of the multi-parameters influence and control in thermosonic chip packaging interface manufacturing is put forward, and some important conclusions are attained, which include: the forming physical mechanism of the bonding interface structure and bonding strength; the movement characteristics of the bonding interface by the ultrasonic effect; the dynamical model and ultrasonic propagation of the transducer system. The research work was summarized for report.