| 复合添加Ga,Al,Ag对Sn-9Zn钎料性能的影响 |
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| 引用本文： | 王慧,薛松柏,陈文学,王俭辛.复合添加Ga,Al,Ag对Sn-9Zn钎料性能的影响[J].焊接学报,2009,30(6):21-24. |
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| 作者姓名： | 王慧 薛松柏 陈文学 王俭辛 |
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| 作者单位： | 南京航空航天大学,材料科学与技术学院,南京,210016 |
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| 基金项目： | 2006年江苏省“六大人才高峰”资助项目(06-E-020) |
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| 摘 要： | 采用润湿平衡法研究了合金元素Ga,Al,Ag复合添加对Sn-9Zn钎料润湿性的影响.结果表明,Ga,Al,Ag的最佳添加量分别为0.2,0.002,0.25(质量分数,%);添加合金元素后钎料的高温抗氧化性能显著提高.俄歇电子能谱分析表明,Sn-9Zn-0.2Ga-0.002Al-0.25Ag钎料表面Al高度富集并形成一层致密的氧化膜,可阻挡氧向液态钎料内部扩散,减少钎料的氧化.Sn-9Zn-0.2Ga-0.002Al-0.25Ag钎料与Cu/Ni/Au基板之间的金属间化合物由一层平坦的AuZn3和颗粒状的AuAgZn2化合物组成.另外,微焊点力学试验表明,采用Sn-9Zn-0.2Ga-0.002Al-0.25Ag钎料时,电子元器件与基板间微焊点的力学性能比Sn-9Zn钎料略有提高.
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| 关 键 词： | 无铅钎料 Sn-Zn Ga元素 润湿性 |
| 收稿时间： | 2009/1/21 0:00:00 |
Effects of Ga,Al and Ag multi-additions on wetting properties of Sn-9Zn lead-free solders |
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| WANG Hui,XUE Songbai,CHEN Wenxue and WANG Jianxin.Effects of Ga,Al and Ag multi-additions on wetting properties of Sn-9Zn lead-free solders[J].Transactions of The China Welding Institution,2009,30(6):21-24. |
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| Authors: | WANG Hui XUE Songbai CHEN Wenxue and WANG Jianxin |
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| Affiliation: | College of Materials Science and Technology;Nanjing University of Aeronautics and Astronautics;Nanjing 210016;China |
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| Abstract: | Wetting balance method is used to evaluate the effects of Ga,Al,and Ag multi-additions on the wetting property of Sn-9Zn lead-free solders.Results show that the optimal loading of Ga,Al,and Ag is 0.2 wt.%,0.002 wt.%,and 0.25 wt.% respectively.The intermetallics formed at the interface of Sn-9Zn-0.2Ga-0.002Al-0.25Ag solder and Cu/Ni/Au substrate is investigated by scanning electron microscope(SEM)and energy dispersive spectroscopy(EDS)analysis.SEM images illustrate that two portions,a planar AuZn3 layer and ... |
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| Keywords: | lead-free solder Sn-Zn Ga wettability |
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