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氧化铝颗粒的表面改性及其在C平面(0001)蓝宝石衬底上的化学机械抛光(CMP)性质
引用本文:汪为磊,刘卫丽,白林森,宋志棠,霍军朝.氧化铝颗粒的表面改性及其在C平面(0001)蓝宝石衬底上的化学机械抛光(CMP)性质[J].无机材料学报,2017,32(10):1109-1114.
作者姓名:汪为磊  刘卫丽  白林森  宋志棠  霍军朝
作者单位:(1. 中国科学院 上海微系统与信息技术研究所, 信息材料国家重点实验室, 纳米技术实验室, 上海 200050; 2. 中国科学院大学, 北京100049; 上海新安纳电子科技有限公司, 上海 201506)
摘    要:为了提高氧化铝颗粒的CMP性能, 本工作探索了一种合适的改性方法。同时, 为了改善其化学机械性能, 通过与其表面羟基的硅烷化化学反应和与Al和仲胺的络合两种作用, 用N-(2-氨基乙基)-3-氨基丙基三甲氧基硅烷表面改性氧化铝颗粒。本工作给出了化学反应机理, 即N-(2-氨基乙基)-3-氨基丙基三甲氧基硅烷接枝到氧化铝表面。通过傅里叶变换红外光谱(FTIR)和X射线光电子能谱(XPS)表征了改性氧化铝颗粒的组成和结构。结果表明: N-(2-氨基乙基)-3-氨基丙基三甲氧基硅烷已被成功地接枝到氧化铝颗粒的表面, 导致改性比未改性的氧化铝颗粒具有更好的化学和机械性能。测试了未改性和改性的氧化铝颗粒在蓝宝石基底上的CMP性能。结果显示: 改性氧化铝颗粒比未改性氧化铝颗粒有更高的材料去除速率和更好的表面质量。即, 改性氧化铝颗粒在pH=10时比未改性氧化铝颗粒在pH=13.00时表现出更高的材料去除率, 这将为减少设备腐蚀提供新思路。

关 键 词:改性方法  N-(2-氨基乙基)-3-氨基丙基三甲氧基硅烷  化学机械抛光  CMP  氧化铝抛光液  
收稿时间:2017-01-17

Surface Modified Alumina Particles and Their Chemical Mechanical Polishing (CMP) Behavior on C-plane (0001) Sapphire Substrate
WANG Wei-Lei,LIU Wei-Li,BAI Lin-Sen,SONG Zhi-Tang,HUO Jun-Chao.Surface Modified Alumina Particles and Their Chemical Mechanical Polishing (CMP) Behavior on C-plane (0001) Sapphire Substrate[J].Journal of Inorganic Materials,2017,32(10):1109-1114.
Authors:WANG Wei-Lei  LIU Wei-Li  BAI Lin-Sen  SONG Zhi-Tang  HUO Jun-Chao
Affiliation:(1. State Key Laboratory of Functional Materials for Informatics, Laboratory of Nanotechnology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China; 2. Graduate School of the Chinese Academy of Sciences, Beijing 100049, China; 3. Xinanna Electronic Technology Co.,Ltd., Shanghai 201506, China)
Abstract:To improve the Chemical Mechanical Polishing (CMP) performance of alumina particles in aqueous solu-tion, a suitable modification method was explored. Meanwhile, in order to improve their chemical mechanical per-formance, alumina particles were surface modified with N-(2-aminoethyl)-3-aminopropyltrimethoxysilane through si-lanization chemical reaction with their surface hydroxyl groups and complexation with Al and secondary amine. This work gives a detailed and thorough chemical reaction mechanism that N-(2-aminoethyl)-3-aminopropyltrimethoxysilane grafted onto the surface of alumina. The compositions and structures of the modified alumina particles were character-ized by Fourier transform infrared spectroscopy (FTIR), and X-ray photoelectron spectroscopy (XPS). The results supported that the N-(2-aminoethyl)-3-aminopropyltrimethoxysilane was perfectly grafted onto the surface of alumina particles, which led to the modified alumina particles with better surface chemical and mechanical properties than un-modified alumina particles. Then, CMP performance of the unmodified and modified alumina particles on the sapphire substrate was tested. The results showed that the modified alumina particles exhibited higher material removal rate (MRR) and better surface quality than unmodified alumina particle. The focus is that the modified alumina particles manifested higher MRR at p H 10.00 than the unmodified alumina particles at PH 13.00, which may open a way to reduce corrosion of equipment.
Keywords:modification method  N-(2-aminoethyl)-3-aminopropyltrimethoxysilane  chemical mechanical polishing  Chemical Mechanical Polishing (CMP)  alumina slurry  
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