| PCB板酸性蚀刻机理、工艺参数及故障排除 |
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| 引用本文： | 吴培常,程静,陈良.PCB板酸性蚀刻机理、工艺参数及故障排除[J].印制电路信息,2012(2):31-37. |
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| 作者姓名： | 吴培常 程静 陈良 |
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| 作者单位： | 广东成德电路股份有限公司,广东佛山,528300 |
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| 摘 要： | 蚀刻工艺是目前PCB板制作中的重要工序之一,特别是随着微电子技术的飞速发展,大规模集成电路和超大规模集成电路的广泛应用,对PCB板制造技术提出了更高的要求,正向着高精度、高密度的方向飞速发展,对PCB板蚀刻的线宽公差也提出更高、更严的技术要求,所以,充分了解和掌握铜在各种类型蚀刻液中的蚀刻机理,并通过严格的科学实验,测定出铜在各类蚀刻液中工艺参数,才能把控好PCB板蚀刻这一关键工序。本文就我公司AS-301型酸性蚀刻液特点、蚀刻机理、来料检测、操作规程、工艺流程、故障排除等作简单介绍。
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| 关 键 词： | 蚀刻机理 蚀刻速率 再生 氧化还原电位 |
PCB acid etching mechanism,technological parameters and trouble shooting |
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| WU Pei-chang CHEN Jing CHEN Liang.PCB acid etching mechanism,technological parameters and trouble shooting[J].Printed Circuit Information,2012(2):31-37. |
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| Authors: | WU Pei-chang CHEN Jing CHEN Liang |
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| Affiliation: | WU Pei-chang CHEN Jing CHEN Liang |
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| Abstract: | Presently etching has become necessarily procedure in manufacturing PCB boards,which developes at very fast speed along with micro-electronics,LSI and VLSI application in our daily life.It brings higher PCB manufacturing techniques with higher requirements,moving on more precise and denser direction at very speed,and brought higher and stricter technical requirements than ever in wire width tolerance of PCB.So fully understand and master copper clad laminate etching mechanism in all kinds of etchant by doing strict scientific experiment,determining copper clad laminate technical parameters in all kinds of etchant is important.Then we make simple introduction of characteristics of AS-301 model acid etchant,which is used in our company based on etching mechanism,incoming material check-up,operational regulations,technical flow and disposing failure,etc. |
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| Keywords: | etching mechanism etching velocity regeneration ORP（oxidation-reduction potential） |
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