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| 电子组装用焊锡粉雾化制备技术现状与发展 | |
| 引用本文： | 黄迎红,华林. 电子组装用焊锡粉雾化制备技术现状与发展[J]. 电子工艺技术, 2007, 28(2): 63-66,70 |
| 作者姓名： | 黄迎红 华林 |
| 作者单位： | 云南锡业集团有限责任公司,云南,个旧,661000;武汉理工大学,湖北,武汉,430070 |
| 摘 要： | 焊锡粉是焊锡膏的主要成分,其质量的好坏对焊锡膏的印刷质量起着至关重要的作用.概述了焊锡粉的分类、性能及应用,并重点介绍了当前雾化法制备焊锡粉的技术与特点.结合制粉技术的发展,对球形焊锡粉新型制备技术进行了展望. |
| 关 键 词： | 表面组装 焊锡膏 焊锡粉 雾化法 |
| 文章编号： | 1001-3474（2007）02-0063-05 |
| 修稿时间： | 2007-03-01 |
Current Technology and Development of Vapour Preparation of Solder Powder in Surface Mount Technology |
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| HUANG Yin-hong,HUA Lin. Current Technology and Development of Vapour Preparation of Solder Powder in Surface Mount Technology[J]. Electronics Process Technology, 2007, 28(2): 63-66,70 | |
| Authors: | HUANG Yin-hong HUA Lin |
| Affiliation: | 1. Yunnan Tin Company Group Limited,Gejiu 61000 ,China; 2. Wuhan Univeristy of Technology,Wuhan 430070, China |
| Abstract: | Solder powder is the main component of solder paste, and the quality of paste print mostly depend on the solder powder. Summarize the sort, capability and application of solder powder, review the current technology of vapour preparation. Look forward new preparation technology for producing spherical solder powder according to development of powder technology. |
| Keywords: | Surface mount technology Solder paste Solder powder Vapour |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |