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国内外电真空用氧化铝陶瓷金属化层显微结构分析
引用本文:张巨先.国内外电真空用氧化铝陶瓷金属化层显微结构分析[J].真空电子技术,2003(4):24-25,36.
作者姓名:张巨先
作者单位:北京真空电子技术研究所,北京,100016
摘    要:利用扫描电镜和能谱仪,分析了国内、俄罗斯、英国及德国公司生产的电真空用氧化铝陶瓷的金属化层显微结构和微区成分。比较了4种金属化样品间的差异,并探讨了金属化层显微结构对焊接体焊接性能的影响。

关 键 词:氧化铝陶瓷  显微结构  金属化层  电真空器件  焊接性能  电真空材料
文章编号:1002-8935(2003)04-0024-02

Microstructure of Metallized Alumina Ceramics Applied in Vacuum Electronics Components of Domestic and Oversea
Zhang Ju-xian.Microstructure of Metallized Alumina Ceramics Applied in Vacuum Electronics Components of Domestic and Oversea[J].Vacuum Electronics,2003(4):24-25,36.
Authors:Zhang Ju-xian
Abstract:The microstructure of metallized alumina ceramics applied in vacuum electro n ics components produced by China, Russia, England, and German were analyzed by S EM and EDS. There was difference between microstructure of four kinds metallized alumina. In addition, the effect of microstructure of metallized alumina on joi ning was discussed.
Keywords:Alumina ceramics  Microstructure  Metallized  layer  Vacuum electronics components  
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