Simultaneous estimation of heat transfer coefficient and thermal conductivity with application to microelectronic materials

An estimation of unknown properties of materials arises naturally when one considers some aspects of thermal modeling, especially carried out by widely used numerical methods, e.g. Finite Element Method (FEM).We propose a new approach of simultaneous thermal conductivity and heat transfer coefficient estimation based on thermographic measurements. A linear, steady-state distributed parameter model is used in order to describe the test sample. Thermal properties measurement is equivalent to the unknown parameter estimation of this system. The proposed method is practically applied for estimation of thermal conductivity and heat transfer coefficient of thick-film modules made on alumina (96% Al₂O₃) and DP951 ceramic substrates. In these experiments a high-resolution thermographic scanner is used.The obtained results for thermal conductivity and heat transfer factor are fully comparable with previously published ones.