表面活性剂对电沉积钴析氢的影响研究

低热膨胀系数的钴具有取代铜成为下一代集成电路互连金属的前景而备受关注。本文研究了不同表面活性剂对电沉积钴析氢的影响,分别使用了阴离子表面活性剂十二烷基硫酸钠、阳离子表面活性剂三乙醇胺和非离子表面活性剂聚乙二醇、N-甲基吡咯烷酮、聚乙烯吡咯烷酮。通过霍尔槽电镀实验及电化学测试方法分析了不同表面活性剂对电沉积钴的影响,并探究了表面活性剂对镀层质量的影响。使用金相显微镜和扫描电子显微镜观察镀层,通过接触角测试仪探究不同表面活性剂对镀层的润湿性。对比实验表明,表面活性剂能够抑制析氢并可有效改善电沉积钴镀层质量。

Effect of Surfactants on Hydrogen Evolution of Electroplating Cobalt

Cobalt has been focused because it has the potential for alternative copper to be the next gen eration material in integrated circuit interconnection with its low coefficient of thermal expansion proper ty. In this paper,the effects of surfactants on cobalt deposition were studied,including sodium dodecyl sulfate,triethanolamine,polyethylene glycol,N -methyl pyrrolidone and polyvinylpyrrolidone. The ef fects of surfactants on the quality of coatings were investigated by Hull cell plating experiments and elec trochemical tests. The quality of the coating was analyzed by using a metallographic microscope and a scanningelectronmicroscopeandwettingpropertiesofthesurfactantstothecoatingweretested.Compar ative experiments show that surfactant can inhibit hydrogen evolution and can effectively improve the quality of electroplated cobalt deposition.