A dual BIE approach for large‐scale modelling of 3‐D electrostatic problems with the fast multipole boundary element method

A dual boundary integral equation (BIE) formulation is presented for the analysis of general 3‐D electrostatic problems, especially those involving thin structures. This dual BIE formulation uses a linear combination of the conventional BIE and hypersingular BIE on the entire boundary of a problem domain. Similar to crack problems in elasticity, the conventional BIE degenerates when the field outside a thin body is investigated, such as the electrostatic field around a thin conducting plate. The dual BIE formulation, however, does not degenerate in such cases. Most importantly, the dual BIE is found to have better conditioning for the equations using the boundary element method (BEM) compared with the conventional BIE, even for domains with regular shapes. Thus the dual BIE is well suited for implementation with the fast multipole BEM. The fast multipole BEM for the dual BIE formulation is developed based on an adaptive fast multiple approach for the conventional BIE. Several examples are studied with the fast multipole BEM code, including finite and infinite domain problems, bulky and thin plate structures, and simplified comb‐drive models having more than 440 thin beams with the total number of equations above 1.45 million and solved on a PC. The numerical results clearly demonstrate that the dual BIE is very effective in solving general 3‐D electrostatic problems, as well as special cases involving thin perfect conducting structures, and that the adaptive fast multipole BEM with the dual BIE formulation is very efficient and promising in solving large‐scale electrostatic problems. Copyright © 2007 John Wiley & Sons, Ltd.