A colloidal approach to prepare binder and crack-free TiO2 multilayer coatings from particulate suspensions: Application in DSSCs |
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| Affiliation: | 1. Department of Materials Science and Engineering and Chemical Engineering, University Carlos III of Madrid, Avda. Universidad 30, 28911 Leganés, Madrid, Spain;2. Institute of Ceramic and Glass, CSIC, C/Kelsen 5, 28049 Madrid, Spain;3. Hispano Italiana de Revestimientos S.A, Santander, Spain;1. Pavai College of Technology, Pachal, Namakkal, India;2. Center of Excellence in Electrochemistry, School of Chemistry, College of Science, University of Tehran, Iran;3. Department of Engineering, University of Messina, C.da Di Dio, I-98166 Messina, Italy;4. Tagore Institute of Engineering and Technology, Attur, Salem 636 112, Tamilnadu, India;1. Department of Materials Science and Engineering, IAAB, University Carlos III, Avda. Universidad, 30, 28911 Leganés, Madrid, Spain;2. Instituto de Cerámica y Vidrio, CSIC, c/Kelsen 5, 28049, Madrid, Spain |
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| Abstract: | A porous well-consolidated and crack-free TiO2 multilayer coatings have been manufactured from a colloidal approach based on the preparation of particulate suspensions for DSSC. The study of the suspension parameters to optimize dispersion and stabilization of the TiO2 nanoparticle in the liquid media as well as a thermal stabilization step between the layers have been defined as two key points in the processing method to obtain interconnected microstructures, free of defects and heterogeneities, that prevent the application of an additional scattering layer or any kind of specific or clean conditions during deposition. The sintering process at low temperature, 450⁰C, has allowed obtaining open microarchitectures avoiding the complete densification and favoring the dye adsorption. A thickness of 12.8 μm resulted in a successful dye loading of 4.52 × 10−10 mol·mm−2 and a photoefficiency of 5.7%, both in the range of the others particulate systems. EIS measurements were also made to study the transfer charge phenomena. |
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| Keywords: | Particulate suspensions Colloidal processing Crack-free DSSCs |
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