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Analytical and Experimental Study on Suppression of Electromagnetic Interference on High Speed Printed Circuit Board for Wireless Communication Systems
Authors:Rajeswari Packianathan  Raju Srinivasan
Affiliation:1.Velammal College of Engineering and Technology,Madurai,India;2.Thiagarajar College of Engineering,Madurai,India
Abstract:In this paper, a novel routing topology is proposed to reduce crosstalk between parallel links used for high data rate application. Generally, microstrip lines are used in high frequency RF printed circuit boards for propagating high speed signals in wireless communication. Since RF front end modules in wireless system supports a wide ultra wide band frequency range from 700 MHz to 12 GHz, package density parasitic effects have been a major issue which degrades system performance. The close proximity of signal transmission lines with a high packing density results signal integrity problems such as crosstalk and timing jitter. A modified coupled microstrip line is proposed to reduce crosstalk by means of increasing capacitive coupling ratio. Our proposed structure reduced far end crosstalk by 4 dB and near end crosstalk by 4 dB than existing structures. The proposed microstrip line increased the maximum data rate from 1 to 3.3 Gb/s and reduced timing jitter by 51 ps at 3.3 Gb/s.
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