| COM组件技术及其在三层结构模型中的应用 |
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| 引用本文： | 康萍.COM组件技术及其在三层结构模型中的应用[J].微电子学与计算机,2005,22(6):181-183,187. |
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| 作者姓名： | 康萍 |
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| 作者单位： | 西安财经学院信息学院,陕西,西安,710061 |
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| 摘 要： | COM,即组件对象模型,是一种以组件为发布单元的对象模型,这种模型使各软件组件可用一种统一的方式进行交互.COM的中心思想就是定义软件中可以重用的部分,每一部分组件都有其特定的界面和所能提供的服务.分布式COM(DCOM:Distributed COM)扩展了COM,使之可以跨越机器的边界,从而使得COM组件能以一种位置透明的方式提供远程应用.为了实现三层C/S应用系统,需要各种开发工具的支持,COM技术就是实现三层应用系统的基础平台.
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| 关 键 词： | 三层结构模型 |
| 文章编号： | 1000-7180(2005)06-181-03 |
COM Package Technology and Application in Three Layers of Structure Model |
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| KANG Ping.COM Package Technology and Application in Three Layers of Structure Model[J].Microelectronics & Computer,2005,22(6):181-183,187. |
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| Authors: | KANG Ping |
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| Abstract: | COM, namely package target's model, is one kind of model that regards package as target's model of issuing unit. This kind of model makes various software packages interact mutually in a kind of unified way. The central idea of COM is to define the parts that can be reused in the software. Each package has specific interface and offers specific services. Distributed COM (DCOM) has expanded COM, and makes it cross over the border of the machine, thus make COM package able to offer long-range application by way of a transparent position. COM technology is the basic platform that realizes application system of three layers. |
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| Keywords: | COM DCOM |
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