首页 | 本学科首页   官方微博 | 高级检索  
     

EPS板-玄武岩纤维中空织物保温板导热性能模拟
引用本文:郑杨梅,田艳,秦子鹏,李刚,马玉薇.EPS板-玄武岩纤维中空织物保温板导热性能模拟[J].塑料,2019(2):82-85.
作者姓名:郑杨梅  田艳  秦子鹏  李刚  马玉薇
作者单位:石河子大学水利建筑工程学院
基金项目:国家自然科学基金(51468056);新疆建设兵团工业高新技术科技攻关与成果项目(2015AB026)
摘    要:通过数值模拟与试验方法,研究了EPS板-玄式岩纤维中空织物保温板的导热性能;采用一维稳态热流计法进行试验,测试了不同厚度EPS板与占武岩纤维中空织物组合而成的新型保温板的导热系数;并利用软件ANSYS Workbench对新型保温板的传热机理进行模拟,同时结合相关理论公式,对新型保温板的导热系数进行理论计算。数值模拟和实验结果表明,玄武岩纤维中空织物可以大幅降低EPS板的厚度,能够有效阻止温度降低,提高保温板整体的保温隔热性能;有限元模拟得到的导热系数预测值与实验测试结果相比,最大误差为8.8%,两者基本一致.

关 键 词:EPS板  玄式岩纤维中空织物  保温板  导热系数  数值模拟

Simulation of the Thermal Property of EPS-Basalt Fiber Hollow Fabric Insulation Board
ZHENG Yangmei,TIAN Yan,QIN Zipeng,LI Gang,MA Yuwei.Simulation of the Thermal Property of EPS-Basalt Fiber Hollow Fabric Insulation Board[J].Plastics,2019(2):82-85.
Authors:ZHENG Yangmei  TIAN Yan  QIN Zipeng  LI Gang  MA Yuwei
Affiliation:(College of Water Conservancy and Architectural Engineering,Shihezi University, Shihezi,Xinjiang 832000,China)
Abstract:The thermal conductivity of EPS board basalt fiber hollow fabric insulation board was studied by numerical simulation and experimental methods. The thermal conductivity of a new type of insulation board with different thickness of EPS plate and basalt fiber hollow fabric was tested by one-dimensional steady heat flow meter. The heat transfer mechanism of the new type insulation board was simulated by software ANSYS Workbench, and the heat conduction of the new thermal insulation board was combined with relevant theoretical formulas. The coefficient was calculated theoretically. The results of numerical simulation and experiment showed that the basalt fiber hollow fabric could greatly reduce the thickness of EPS, and it could effectively prevent the temperature drop and improve the overall thermal insulation performance of insulation board. The predicted value of the thermal conductivity obtained by the finite element method was basically consistent with the value of the experiment result, and the maximum error was 8. 8%.
Keywords:EPS  basalt fiber hollow fabric  insulation board  the thermal conductivity  numerical simulation
本文献已被 CNKI 维普 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号