W-Cu(Mo-Cu)复合材料的最新研究状况

W/Cu或 Mo/Cu两相复合材料具有较高的导热性和低的热膨胀系数 ,在大功率器件中被视为一种很好的热沉材料。近些年来 ,有关 W/Cu或 Mo/Cu作为电子热沉材料的研究在国内外已有一些报道。本文主要就近几年钨铜复合材料研究的几个主要热点问题进行了综合性的报导。梯度结构功能材料、纳米结构材料、以及注射成型工艺在钨铜复合材料领域中的应用为当今钨铜电子材料发展的主要方向 ,并对国内外最新研究作了比较详细的综合归纳总结 ,同时提出今后发展的主要动向。

THE NEW DEVELOPMENTS OF TUNGSTEN-COPPER(MOLYBDENUM-COPPE R) COMPOSITE

Because of the high thermal conductivity and the low coefficient of thermal expansion,the W-Cu(Mo-Cu) composites are now used as heat sink materials in semiconductor as well as other fields.This paper concludes all the hot fields concerning the W-Cu composites.The development of W-Cu(Mo-Cu) composites as heat sink materials have been reviewed so as to the properties and production routes of the materials,Three aspects:functionally gradient materials,nano-structured materials and PIMed W-Cu composites as well as the industry production routes to whole-produce the materials are given a overall review.