| 无铅封装中镀覆层对PBGA耐湿热可靠性的影响 |
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| 引用本文： | 周鹏,海洋,马亚辉.无铅封装中镀覆层对PBGA耐湿热可靠性的影响[J].桂林电子科技大学学报,2009,29(6):503-506. |
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| 作者姓名： | 周鹏 海洋 马亚辉 |
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| 作者单位： | 桂林电子科技大学机电工程学院,广西,桂林,541004 |
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| 摘 要： | 随着电子产业中无铅替代有铅的迫切要求,无铅产品的应用越来越广泛,多种材料在无铅电子封装中的应用,使得界面反应与含铅产品相比更为复杂.通过对PBGA器件与不同表面镀层(OSP,ENIG)的PCB板互连形成的SnAgCu焊点,在高湿和炎热条件下的可靠性进行研究.试验结果表明:焊点的寿命在使用ENIG镀层时比使用OSP镀层时更长,说明焊点的可靠性与界面金属间化合物类型密切相关;试验后期还发现器件本身最易产生裂纹的地方位于芯片(DIE)、粘接层材料(DA)和塑封材料(EMC)交界处的芯片以及芯片和DA材料交界处的芯片上,主要是因为芯片与聚合物材料间不能形成过渡层,芯片应力无法得到松弛.
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| 关 键 词： | 无铅 湿热 界面反应 可靠性 |
Reliability analysis of PBGA devices with different finishes under hygrothermal environment in lead-free electronics package |
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| ZHOU Peng,HAI Yang,MA Ya-hui.Reliability analysis of PBGA devices with different finishes under hygrothermal environment in lead-free electronics package[J].Journal of Guilin Institute of Electronic Technology,2009,29(6):503-506. |
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| Authors: | ZHOU Peng HAI Yang MA Ya-hui |
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| Affiliation: | ZHOU Peng,HAI Yang,MA Ya-hui (School of Mechanical and Electrical Engineering,Guilin University of Electronic Technology,Guilin 541004,China) |
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| Abstract: | With the urgent request of the lead-free alternative lead in electronic industry,lead-free products are more and more widely used,and various materials are being used in lead-free electronics packaging application.Compared with the lead-based products,the interfacial reaction become more complex.The reliability of SnAgCu solder between PBGA and PCB with different finishes(OSP,ENIG) under humidity temperature circulation were investigated.The results showed that: The solder with ENIG finishes presented a bet... |
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| Keywords: | lead-free hygrothermal interfacial reaction reliability |
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