60GHz 毫米波在芯片无线互连中的传播特性研究

研究了60GHz 毫米波在芯片无线互连特定场景下的电磁传播问题。应用完整电磁理论,以单极阵子为研究对象在收发天线正对、非正对两种情形中,对径向分量在完整电磁波中的作用进行理论分析及数值仿真。数值仿真结果表明:当收发天线间距小于3 倍波长时,径向分量对完整电磁波有一定的贡献;当收发天线间距大于3 倍波长时,可应用传统远场分析进行近似处理。此外,在HFSS 中对特定的芯片间无线互连场景进行了建模及电磁仿真:当天线两端到PCB 介质板的距离约小于0. 7 ~ 0. 8mm 时,PCB 介质板对电磁波的反射会对天线造成一定的频偏,该频偏随着天线到PCB 介质板的距离的增大而减小;当天线两端到PCB 介质板的距离约大于0. 7 ~ 0. 8mm 时,基本不会造成频偏。这为60GHz 毫米波在芯片间无线互连中的应用提供了电磁传播的理论依据。

60GHz Millimeter-Wave Propagation Characteristic for Inter / Intra Chip Wireless Interconnection

In this paper electromagnetic of the 60GHz millimetre wave transmission in the scenarios of chip wireless interconnection is studied. In the two situations that sending antenna and receiving antenna are placed vertically and in the same horizontal line or not, with the monopole antenna as the research object, the radial component of the role in the complete electromagnetic propagation is studied and numerically simulated with complete electromagnetic propagation theory. Moreover, the model is structured and simulated for inter/ intra chip wireless interconnection in HFSS. The result shows that the role of radial component cannot be ignored when the transmission distance is less than 3 times of wavelength, and that the induction electromotive force is almost no difference with or without radial component when the transmission distance is more than 3 times of wavelength. In addition, the model of chip wireless interconnection is built and simulated when PCB medium is pec and FR4 respectively in the HFSS. The result shows that the electromagnetic wave reflection produced by PCB board causes the frequency deviation of antenna, and that the frequency deviation decreases with the distance between antenna and PCB board. Moreover, the frequency deviation disappears when the distance between antenna and PCB board is more than 0. 7 ~0. 8mm. This paper provides the theory basis of the electromagnetic propagation for application of 60GHz millimeter- wave in inter/ intra chip wireless interconnection.