孔口铜丝问题的原因分析与改善

电镀工艺能够增加面铜厚度并实现不同层次的导电连接而被广泛的应用于PCB行业。然而，针对该工艺的品质保证绝非易事。电镀工艺受钻孔效果、沉铜前处理、电镀参数等因素的影响，在品质上容易出现铜丝铜粒等不良问题。本文从电镀基本原理出发，初步分析了电镀工艺铜丝的产生原因，并通过试验验证了铜丝产生的原因，得出了有效的改善措施。

The cause and improvement of copper wire defect

The electroplating technique is widely used in PCB industry for its function of increasing the surface copper thickness and realizing electrical conduction between different layers. However, quality assurance is a difficult part in the application of the technique. For the influence of the drilling quality, pre-PTH treatments, electroplating parameters etc, defects like the copper wire and copper grains are easily to occur in the manufacturing. The paper analyses the causes of the copper wire in terms of the electroplating technique and test the causes further. And finally the improving measurements adopted proved to be effective.