航天用刚挠印制板可靠性研究

通过分析影响航天用刚挠印制板可靠性的主要因素分层和金属化孔的质量,从刚挠印制板的设计、工艺控制等角度提出适合于航天用刚挠印制板的材料、关键工序工艺条件以及特殊检验要求。通过振动试验、加速度试验、加严热冲击试验、焊接后高低温循环试验等试验证明了高可靠性刚挠印制板可以应用于航天器产品,并给出航天用刚挠印制板具体的材料、生产工艺及关键工艺参数建议。

Study of Reliability of Rigid-flexible printed board for Spacecraft Abstract

Analyze the impact of delamination and the quality of PTH on spacecraft reliability of rigid-flexible printed board. Put forward requirements for spacecraft from the design of rigid-flexible printed board and process control for rigid-flexible printed board material, key process conditions and specific inspection. Through vibration test, acceleration test, strict thermal shock test, thermal cycle test after soldering proved the high reliability of rigid-flex printed circuit board, which can be applied to spacecraft products. Give out materials, process suggestions and key parameters for the spacecraft rigid-flexible printed board.