导热型高性能树脂微电子封装材料之一:封装材料的制备

微电子行业迫切需要新一代优异性能的封装材料。采用聚酰亚胺／氮化铝复合材料作为封装材料，可以组合聚酰亚胺和氮化铝的优点，具有高导热、低热胀、低介电、电绝缘等优异的性能，应用于现代微电子领域前景良好。文章讨论了这种封装材料的制各，首先将单体反应物反应得到聚酰亚胺预聚体，然后将预聚体与氮化铝高能球磨混合，最后热压成型。成功制各出一系列聚酰亚胺／氮化铝复合导热型高性能塑料微电子封装材料。

Thermal Conductive High Performance Polymer Microelectronic Packaging Material(Ⅰ):Preparation of the Packaging Material

It is an urgent demand of new generation packaging materials with excellent properties in the microelectronic industry. Polyimide/AlN composite materials, combining the properties of polyimide and AlN, exhibits high thermal conductivity, low thermal expansion coefficient, low dielectric constant, and excellent insulation, and will be an attractive packaging material. The preparation of the packaging material is discussed in this paper. The first step is the preparation of pre polymer from monomeric reactants, then the pre polymer is mixed with AlN powder by ball milling, and finally the packaging material is made by hot press molding. A series of polyimide/AlN composite packaging material are prepared successfully.