| MLCC端电极Sn镀层的焊接失效分析 |
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| 引用本文： | 庄立波,包生祥,汪蓉.MLCC端电极Sn镀层的焊接失效分析[J].电子元件与材料,2009,28(3). |
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| 作者姓名： | 庄立波 包生祥 汪蓉 |
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| 作者单位： | 1. 电子科技大学,电子薄膜与集成器件国家重点实验室,四川,成都,610054
2. 成都宏明电子科大新材料有限公司,四川,成都,610058 |
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| 摘 要： | 针对多层陶瓷电容器(MLCC)端电极Sn镀层的可焊性失效问题,运用SEM和能谱仪对Sn镀层进行微观结构和成分分析,找出了失效的主要原因,并提出了改进意见。在对MLCC三层端电极中的底层Ag端浆的烧渗过程中,由于烧渗工艺不合理,Ag浆中出现玻璃料物质的溢出,造成电镀Sn时Sn层不连续、不致密,以至MLCC端电极的可焊性变差。通过设计合理的烧渗银温度曲线可较好地解决MLCC端电极Sn镀层的焊接失效问题。
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| 关 键 词： | MLCC Sn镀层 微观结构 银端浆 失效分析 |
Welding failure analysis of tin coating for the terminal electrode of MLCC |
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| ZHUANG Libo,BAO Shengxiang,WANG Rong.Welding failure analysis of tin coating for the terminal electrode of MLCC[J].Electronic Components & Materials,2009,28(3). |
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| Authors: | ZHUANG Libo BAO Shengxiang WANG Rong |
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| Affiliation: | 1. State Key Laboratory of Electronic Thin Films and Integrated Devices;University of Electronic Science and Technology of China;Chengdu 610054;China;2. Chengdu Hongming UESTC New Material Co.;Ltd;Chengdu 610058;China |
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| Abstract: | Aimed at the welding failure problem of tin coating in multilayer ceramic capacitor (MLCC), the microstructures and components of tin coating were studied with SEM and EDS, and the welding failure modes occurred in the terminal electrode were documented. The failure causes were discussed and improved measures were suggested. During the firing process of silver termination paste in the tri-layer terminal electrode of MLCC, the glass phase which is no-conductive material overflowed the silver layer, resulting... |
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| Keywords: | MLCC |
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