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Thermal diffusivity and conductivity of highly filled epoxies as cover materials for microelectronical devices as measured by the heat pulse technique |
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| Authors: | A. Nyilas R. Rehme C. Wyrwich H. Springer G. Hinrichsen |
| Affiliation: | (1) Institute of Nonmetallic Materials, Polymer Physics Group, Technical University of Berlin, Englische Str. 20, D-10587 Berlin, Germany |
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