| 铜粉添加型导电胶的研制 |
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| 引用本文： | 刘运学,王晓丹,谷亚新,范兆荣. 铜粉添加型导电胶的研制[J]. 中国胶粘剂, 2008, 17(11) |
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| 作者姓名： | 刘运学 王晓丹 谷亚新 范兆荣 |
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| 作者单位： | 1. 东北大学材料与冶金学院,辽宁沈阳,110004;沈阳建筑大学材料科学与工程学院,辽宁沈阳,110168
2. 沈阳建筑大学材料科学与工程学院,辽宁沈阳,110168 |
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| 基金项目： | 辽宁省科学技术基金资助项目 |
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| 摘 要： | 以环氧树脂E-51为导电胶基体树脂、二乙烯三胺为固化剂,采用硅烷偶联剂(KH-550)对铜粉进行改性处理,并以此作为导电填料,制备了热固化各向同性导电胶。通过正交实验探讨了固化剂、硅烷偶联剂、还原剂、稀释剂和导电填料等因素对导电胶固化性能、粘接性能和导电性能的影响,并对导电胶的制备参数进行优化,得到了制备导电胶的最佳方案。实验结果表明,所制备的热固化各向同性导电胶具有制备工艺简单、粘接强度高(剪切强度≥20 MPa)和导电性能好(体积电阻率为1.50×10-3Ω·cm)等特点;经室温1000h老化实验后,导电胶的体积电阻率和剪切强度变化率<20%。
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| 关 键 词： | 导电胶 电子封装 环氧树脂 铜粉 改性 |
Study on conductive adhesive with cuprum powder as conductive filler |
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| LIU Yun-xue,WANG Xiao-dan,GU Ya-xin,FAN Zhao-rong. Study on conductive adhesive with cuprum powder as conductive filler[J]. China Adhesives, 2008, 17(11) |
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| Authors: | LIU Yun-xue WANG Xiao-dan GU Ya-xin FAN Zhao-rong |
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| Affiliation: | LIU Yun-xue 1,2,WANG Xiao-dan 2,GU Ya-xin 1,FAN Zhao-rong 2(1.School of Materials&Metallurgy,Northeastern University,Shenyang 110004,China,2.School of Material Science , Engineering,Shenyang Jian Zhu University,Shenyang 110168,China) |
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| Abstract: | With epoxy resin(E-51)as matrix resin of conductive adhesive,diethylene triamine as curinga gent,cuprum powder which was modified by silane coupler(KH-550)as conductive filler,the heat curinga nd isotropy conductive adhesive was prepared.The influence of different factors such as curing agent,silanec oupler,reducer,thinner and conductive filler were discussed on curing performance,bonding performancea nd conductivity for conductive adhesive by orthogonal experiment.At the same time,the preparation parame-t ... |
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| Keywords: | conductive adhesives electronic packing epoxy resin cuprum powder modification |
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