喷流方式对电镀填孔影响分析

电子产品更轻、更薄的发展趋势,使印制电路板在高密度互连技术上面临挑战。微孔堆叠技术是一种用来实现高密度互连的方法。如今,电镀填孔工艺已得到广泛的应用,主要是通过对流使填孔光剂产生吸附、消耗和扩散,从而填充盲孔。本文着重从底喷的对流的方式来介绍其对盲孔填孔的影响。

Analysis of the eductor process in copper electroplating microvia filling process

The printed circuit board faces a challenge in high density interconnect technology due to the lighter and thinner development trend of electronic products.The micro-via stacking technique is the method to realize high density interconnect technology.Now,micro-via filling by copper electroplating process has been widely applied.It mainly makes the organic additives produce absorption,consumption and diffusion by convection.This thesis mainly introduced the effect to the micro-via filling by the way of the bottom spray convection.