| PDMS微流控芯片中真空氧等离子体键合方法 |
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| 引用本文： | 沈德新,张春权,罗仲梓,周勇亮,张峰,李佳,田昭武. PDMS微流控芯片中真空氧等离子体键合方法[J]. 微纳电子技术, 2003, 0(Z1) |
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| 作者姓名： | 沈德新 张春权 罗仲梓 周勇亮 张峰 李佳 田昭武 |
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| 作者单位： | 厦门大学化学系，厦门大学萨本栋微机电研究中心，厦门大学萨本栋微机电研究中心，厦门大学化学系，厦门大学化学系，厦门大学化学系，厦门大学化学系 固体表面物理化学国家重点实验室，福建厦门361005，福建厦门361005，福建厦门361005，固体表面物理化学国家重点实验室，福建厦门361005，固体表面物理化学国家重点实验室，福建厦门361005，固体表面物理化学国家重点实验室，福建厦门361005，固体表面物理化学国家重点实验室，福建厦门361005 |
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| 摘 要： | 聚二甲基硅氧烷 (PDMS)由于具有良好的力学性质和光学性质以及生物相容性等特点 ,是极具前景的 μTAS应用材料[1] 。由于固化后的PDMS表面具有一定的粘附力 ,一对成型后的PDMS基片不加任何处理 ,即可借助分子间的引力自然粘合 ,但这种粘合强度有限 ,容易发生漏液。Duffy[2 ] 等人采用高真空氧等离子体对PDMS进行处理 ,实现了PDMS芯片的永久性键合。但这种键合技术需要昂贵的高真空等离子体发生设备。孟斐[3] 等人报道了利用紫外光照射对PDMS芯片表面进行改性后键合的方法
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| 关 键 词： | 微流控系统 PDMS芯片 键合 中真空 |
Bonding for poly(dimethylsiloxane) microfluidic chip by oxygen plasma treatment under medium vacuum |
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| SHEN De xin ,ZHANG Chun quan ,LUO Zhong zi ,ZHOU Yong liang ,ZHANG Feng ,LI Jia ,TIAN Zhao Wu. Bonding for poly(dimethylsiloxane) microfluidic chip by oxygen plasma treatment under medium vacuum[J]. Micronanoelectronic Technology, 2003, 0(Z1) |
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| Authors: | SHEN De xin ZHANG Chun quan LUO Zhong zi ZHOU Yong liang ZHANG Feng LI Jia TIAN Zhao Wu |
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| Affiliation: | SHEN De xin 1,ZHANG Chun quan 2,LUO Zhong zi 2,ZHOU Yong liang 1,ZHANG Feng 1,LI Jia 1,TIAN Zhao Wu 1 |
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| Abstract: | A method was developed for bonding the poly(dimethylsiloxane) (PDMS) fabricated microfluidic replica. After the surface of PDMS was treated by oxygen plasma 10～40s under medium vacuum (lower than 13.33Pa), the PDMS plates were irreversibly sealed when the treated surfaces were brought into touch and 1h incubation at 100℃. And the hydrophilic behavior of PDMS replica was improved greatly. Compared with the reported procedures using oxygen plasma pretreatment under high vacuum, the present approach need simpler and cheaper equipment. And shorter treating time is benefit to keep the surface structure of the replica for little temperature rising. |
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| Keywords: | microfluidic system PDMS chip bonding medium vacuum |
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