Size effect on IMC growth induced by Cu concentration gradient and pinning of Ag3Sn particles during multiple reflows |
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| Affiliation: | 1. School of Materials Science and Engineering, Dalian University of Technology, Dalian, 116024, China;2. School of Mechanical Engineering, Dalian University of Technology, Dalian, 116024, China;1. School of Electronic and Information Engineering, South China University of Technology, Guangzhou 510641, China;2. College of Electronic Engineering, South China Agriculture University, Guangzhou 510642, China;3. College of Automation, Zhongkai University of Agriculture and Engineering, Guangzhou 510225, China;1. Platform Technology Laboratory, Samsung Advanced Institute of Technology, Samsung Electronics, Suwon 443-803, Republic of Korea;2. Materials Research Center, Samsung Advanced Institute of Technology, Samsung Electronics, Suwon 443-803, Republic of Korea;1. School of Mechanical Engineering, Dalian University of Technology, 116024, Dalian, China;2. School of Materials Science and Engineering, Dalian University of Technology, 116024, Dalian, China;3. CSC IT Center for Science, Keilaranta 14, P.O. Box 405, FIN-02101 Espoo, Finland;1. School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640, China;2. Centre for Advanced Materials Technology (CAMT), School of Aerospace, Mechanical and Mechatronic Engineering J07, The University of Sydney, NSW 2006, Australia |
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| Abstract: | Size effect on growth kinetics of interfacial intermetallic compound (IMC), induced by Cu concentration gradient and pinning effect of Ag3Sn particles during multiple reflows, was investigated in this article. The simulation results, for Cu distributions in solder bulks of different volumes after a single reflow for 60 s at 250 °C, show that Cu concentration gradient in liquid increases with the growing size of solder bump. On the contrary, resistive pressure of nano particles decreases gradually with the increasing bump size. In conclusion, the pinning effect of Ag3Sn particles on IMC grains plays a dominant role in small samples, whereas the inhibiting effect of Cu concentration gradient is mainly functional in big samples. Combining the two factors, solder bump in an intermediate diameter of 800 μm benefits most and has the largest IMC thickness during multiple reflows. |
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| Keywords: | A Intermetallics B Diffusion C Crystal growth Joining D Interfaces Grain boundary |
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