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Thermomigration of Ti in flip-chip solder joints
Authors:Hsiao-Yun Chen  Han-Wen Lin  Chien-Min Liu  Yuan-Wei Chang  Annie T. Huang  Chih Chen
Affiliation:1. Department of Materials Science and Engineering, National Chiao Tung University, Hsin-chu 30010, Taiwan, ROC;2. Research Center for Applied Sciences, Academia Sinica, Taipei 11529, Taiwan, ROC;1. Laboratoire IMS, Université Bordeaux I, 351 Cours de la Libération, 33405 Talence Cedex, France;2. Information Technology Laboratory LFI, Leibniz Universität Hannover, Schneiderberg 32, 30167 Hannover, Germany;1. Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong;2. Department of Mechanical and Biomedical Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong;3. Department of Industrial and Systems Engineering, PCB Technology Centre, The Hong Kong Polytechnic University, Kowloon, Hong Kong
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