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Nano ZrO2 Particulate-reinforced Lead-Free Solder Composite
作者姓名:Jun  SHEN  Yongchang  LIU  Dongjiang  WANG  Houxiu  GAO
作者单位:College of Materials Science & Engineering,Tianjin University, Tianjin 300072, China
基金项目:中国科学院资助项目,天津市自然科学基金,Fok Ying Tong Education Foundation,FANEDD of China
摘    要:A lead-free solder composite was prepared by adding ZrO2 nanopowders in eutectic Sn-Ag alloy. Microstrucrural features and microhardness properties of those solders with different ZrO2 nanopowder fraction were examined. Results indicate that the addition of ZrO2 nanopowders reduced the size of β-Sn grains and restrained the formation of bulk Ag3Sn intermetallic compounds (IMCs) due to the adsorption effect of the ZrO2 particles. The Vicker's hardness of the obtained lead-free solder composites fits well with the HalI-Petch relationship. The refinement of β-Sn grains favors to improve the microhardness of composite solders.

关 键 词:纳米氧化锆颗粒  微观结构  焊接复合料  显微硬度
收稿时间:2005-06-23

Nano ZrO2 Particulate-reinforced Lead-Free Solder Composite
Jun SHEN Yongchang LIU Dongjiang WANG Houxiu GAO.Nano ZrO2 Particulate-reinforced Lead-Free Solder Composite[J].Journal of Materials Science & Technology,2006,22(4):529-532.
Authors:Jun SHEN  Yongchang LIU  Dongjiang WANG  Houxiu GAO
Affiliation:College of Materials Science & Engineering, Tianjin University, Tianjin 300072, China
Abstract:A lead-free solder composite was prepared by adding ZrO2 nanopowders in eutectic Sn-Ag alloy. Microstructural features and microhardness properties of those solders with different ZrO2 nanopowder fraction were examined. Results indicate that the addition of ZrO2 nanopowders reduced the size ofβ-Sn grains and restrained the formation of bulk Ag3Sn intermetallic compounds (IMCs) due to the adsorption effect of the ZrO2 particles. The Vicker's hardness of the obtained lead-free solder composites fits well with the Hall-Petch relationship. The refinement of β-Sn grains favors to improve the microhardness of composite solders.
Keywords:ZrO2 nanopowders  Microstructure  Composite solder  Microhardness
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