| 再流焊工艺技术的研究 |
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| 引用本文： | 鲜飞.再流焊工艺技术的研究[J].印制电路信息,2007(12):61-65. |
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| 作者姓名： | 鲜飞 |
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| 作者单位： | 烽火通信科技股份有限公司,湖北 武汉,430074 |
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| 摘 要： | 随着表面贴装技术的发展,再流焊越来越受到人们的重视。文中介绍了再流焊的一般技术要求,并给出了典型温度曲线以及温度曲线上主要控制点的工艺参数。同时还介绍了再流焊中常见的质量缺陷,并粗浅地讨论了其产生的原因及其相应对策。
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| 关 键 词： | 再流焊 表面贴装技术 表面组装组件 温度曲线 |
| 文章编号： | 1009-0096(2007)12-0061-05 |
Study on Reflow Soldering Process |
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| Xian Fei.Study on Reflow Soldering Process[J].Printed Circuit Information,2007(12):61-65. |
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| Authors: | Xian Fei |
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| Abstract: | With the development of Surface Mount Technology, reflow soldering becomes more important. The article introduces the general technology requirements for reflow soldering and typical temperature profile and techni- cal parameter of the main control point at the temperature profile, and also describes common quality defects of reflow soldering, briefly discusses the reasons of production defects and appropriate countermeasure. |
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| Keywords: | reflow soldering SMT SMA temperature profile |
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