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Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints |
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| Authors: | Hao Zhang, Qing-Sheng Zhu, Zhi-Quan Liu, Li Zhang, Hongyan Guo, Chi-Ming Lai |
| Affiliation: | [1]Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China; [2]Jiangyin Changdian Advanced Packaging Co., Ltd., Jiangyin 214431, China |
| Abstract: | Fe-Ni alloy Under bump metallization （UBM） Intermetallic compound （IMC） Reliability High temperature storage Temperature cycling |
| Keywords: | Fe-Ni alloy Under bump metallization （UBM） Intermetallic compound （IMC） Reliability High temperature storage Temperature cycling |
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