| 测辐射热计微桥结构的形变分析 |
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| 引用本文： | 张一中,吴志明,许向东,周影,蒋亚东.测辐射热计微桥结构的形变分析[J].红外技术,2008,30(9). |
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| 作者姓名： | 张一中 吴志明 许向东 周影 蒋亚东 |
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| 作者单位： | 电子科技大学,电子薄膜与集成器件国家重点实验室,四川,成都,610054 |
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| 摘 要： | 采用微加工技术制作测辐射热计阵列时,部分微桥可能发生结构变形,使阵列的性能下降甚至无法正常工作.采用有限元分析方法,对在热膨胀和薄膜应力影响下的I型和L型两种微桥的变形进行了仿真分析,揭示了热膨胀和薄膜应力分别对微桥形变的影响.
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| 关 键 词： | 微桥结构 结构形变 热膨胀 薄膜应力 有限元分析 |
Deformation Analysis of Bolometer Micro-bridges |
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| ZHANG Yi-zhong,WU Zhi-ming,XU Xiang-dong,ZHOU Ying,JIANG Ya-dong.Deformation Analysis of Bolometer Micro-bridges[J].Infrared Technology,2008,30(9). |
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| Authors: | ZHANG Yi-zhong WU Zhi-ming XU Xiang-dong ZHOU Ying JIANG Ya-dong |
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| Affiliation: | ZHANG Yi-zhong,WU Zhi-ming,XU Xiang-dong,ZHOU Ying,JIANG Ya-dong (State Key Laboratory of Electronic Thin Films , Integrated Devices,University of Electronic Science , Technology of China,Chengdu Sichuan 610054,China) |
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| Abstract: | When arrays of bolometers are fabricated with micro-manufacture technology, some micro-bridges will get deformation, which degrades the performance of arrays, even makes them work unnormally. In this article, we analyse I type and L type micro-bridge by using finite elements method, indicate the relationship between the thermal expansion and film stress and the change of the shape of micro-bridges. |
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| Keywords: | micro-bridge deformation thermal expansion film stress finite elements analysis |
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