电镀锡机组软熔导电辊粘锡失效模拟研究

粘锡是宝钢电镀锡机组 2 # 软熔导电辊失效的主要原因 ,通过模拟 2 # 软熔导电辊的工况条件 ,研究了影响导电辊粘锡主要因素。结果表明 ,提高淬水槽水温和导电辊冷却水温 ,都促使导电辊辊面粘锡 ,加剧降低辊面粗糙度。此外提高淬水槽中的锡含量 ,也促使导电辊粘锡。采取带钢出淬水槽后加快带钢冷却和降低导电辊冷却水温等措施 ,可减轻导电辊粘锡 ,提高导电辊寿命。

SIMULATION TO THE BONDING TIN FAILURE OF REFLOWING CONDUCT ROLL AT ELECTROLYTIC TINNING LINE

Bonding tin was the main reason for the failure of 2# conduct roll of reflowing at electrolytic tinning line of Baosteel. The main affecting factors were studied by simulating the production condition. The results showed that increasing the water temperature of quench tank and cooling roll could aggravate the bonding tin on conduct roll and decrease the coarseness degree of roll surface, moreover, increasing the tin content of quench water could promote the bonding of tin on the conduct roll. The measures of fast cooling to the steel plate and decreasing cooling water temperature of conduct roll could decrease the tin bonding and increase the service life of the conduct roll.