| 塑料壳体三维电路制造技术现状分析与应用 |
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| 引用本文： | 李洋,刘斌.塑料壳体三维电路制造技术现状分析与应用[J].塑料制造,2013(11):67-73. |
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| 作者姓名： | 李洋 刘斌 |
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| 作者单位： | 华南理工大学聚合物成型加工工程教育部重点实验室,聚合物新型成型装备国家工程研究中心,广东广州510640 |
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| 摘 要： | 介绍三维电路制造技术的工艺流程平和分类，了详细的阐述。接着介绍了应用三维电路制造的原料，路制造技术的发展趋铅进行了展望。关结合激光诱导金属沉积工艺对激光直接成型技术作特别是用于激光直接成型技术的原料。最后对三维电路制造技术的发展趋铸进行了展望。
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| 关 键 词： | 三维电路 激光直接成型 有机金属复合物 激光诱导金属沉积 化学镀 |
The Analysis and Application of Manufacturing Technology of Three-Dimensional Circuit on Plastic Shell |
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| Li Yang,Liu Bin.The Analysis and Application of Manufacturing Technology of Three-Dimensional Circuit on Plastic Shell[J].Plastics Manufacture,2013(11):67-73. |
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| Authors: | Li Yang Liu Bin |
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| Affiliation: | ＊ ( The Key Laboratory of Polymer Processing Engineering of Ministry of Education, National Engineering Research Center of Novel Equipment for Polymer Processing, South China University of Technology, Guangzhou .q10641, China ) |
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| Abstract: | The manufacturing technology and classification of three-dimensional circuit were introduced in this paper, especially for the laser direct structuring （ LDS ） , which was one kind of tile manufacturing technology of three-dimensional circuit, and combined it with laser-induced metal deposition. Then the materials of three-dimensional circuit were introduced, especially for the materials of LDS. Finally the development trends of the manufacturing technology of three-dimensional circuit were prospected. |
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| Keywords: | Three-dimensional Circuit Laser Direct Structuring Organometallic Complex Laser-induced MetalDeposition Electroless Plating |
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