Microstructural characterization of thin gold films on a polyimide substrate

The study of thin metal films on flexible substrates is of interest for manufacture of many devices, such as implantable electrode arrays consisting of gold film on polyimide substrates. Adhesion of the film to the substrate is of utmost importance for device durability. Gold adhesion to a polyimide has previously been shown to increase when a variety of substrate treatments are performed prior to gold sputter deposition, but little microstructural analysis has been made to complete the process-structure-properties relationship. Here, the grain size is shown to increase slightly but statistically significantly if an oxygen plasma etch and adhesion layer treatment of the film is performed prior to deposition of the gold. A log-normal grain size distribution is found for gold on each sample, and the grains are shown to be columnar. Gold deposited on non-treated polyimide shows a strong {111} texture, but a random texture is seen in both pretreated systems, indicating that the pretreatment affects the surface energy of the polyimide and alters the gold film growth.