| 时效温度下钎料的稀土相CeSn3表面Sn晶须生长 |
| |
| 引用本文： | 田君,李东南,李巍,郝虎.时效温度下钎料的稀土相CeSn3表面Sn晶须生长[J].电子元件与材料,2011,30(4):53-55. |
| |
| 作者姓名： | 田君 李东南 李巍 郝虎 |
| |
| 作者单位： | 福建工程学院材料科学与工程系;北京工业大学机电学院; |
| |
| 基金项目： | 福建省教育厅资助项目(No.JB08191); 福建工程学院院基金资助项目(No.GY—Z0744) |
| |
| 摘 要： | 于Sn3.8Ag0.7Cu钎料中添加过量的稀土Ce会在其内部形成大尺寸的稀土相CeSn3,将稀土相CeSn3暴露于空气中,研究在时效处理过程中时效温度对其表面Sn晶须生长的影响规律.结果表明:时效温度对稀土相CeSn3表面Sn晶须的生长产生显著影响.室温时效20 min后,其表面会形成少量的白色Sn颗粒:75℃时效20...
|
| 关 键 词： | Sn3.8Ag0.7CuCe钎料 稀土相 Sn晶须 时效温度 |
Tin whisker growth on the surface of CeSn_3 phases of solder at aging temperature |
| |
| TIAN Jun,LI Dongnan,LI Wei,HAO Hu.Tin whisker growth on the surface of CeSn_3 phases of solder at aging temperature[J].Electronic Components & Materials,2011,30(4):53-55. |
| |
| Authors: | TIAN Jun LI Dongnan LI Wei HAO Hu |
| |
| Affiliation: | TIAN Jun1,LI Dongnan1,LI Wei1,HAO Hu2(1.Department of Materials Science and Engineering,Fujian University of Technology,Fuzhou 350108,China,2.College of Mechanical Engineering and Applied Electronics Technology,Beijing University of Technology,Beijing 100124,China) |
| |
| Abstract: | Large sized CeSn3 phases were formed in the matrix of Sn3.8Ag0.7Cu solder alloy when adding excessive Ce in it.The effects of aging temperature on tin whisker growth on the surface of CeSn3 phases were investigated during the aging.The results indicate that the aging temperature plays an important role in whisker growing on the surface of CeSn3 phases.During room temperature,a few bright tin particles are formed on the CeSn3 surface after 20 min;during 75 ℃,some rod-like and kinked tin whiskers are formed on the surface of CeSn3 phase after 20 min;however,no whiskers are found and many large hillocks are extruded from the adjacent solder matrix surrounding CeSn3 phases when temperature exceeds 100 ℃. |
| |
| Keywords: | Sn3 8Ag0 7CuCe solder rare earth phase tin whisker aging temperature |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
|
