| JIS Z 3198无铅钎料试验方法简介与评述 |
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| 引用本文： | 王春青,李明雨,田艳红,孔令超.JIS Z 3198无铅钎料试验方法简介与评述[J].电子工艺技术,2004,25(2):47-54. |
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| 作者姓名： | 王春青 李明雨 田艳红 孔令超 |
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| 作者单位： | 哈尔滨工业大学,现代焊接生产技术国家重点实验室,黑龙江哈尔滨,150001 |
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| 摘 要： | JIS Z 3198是关于无铅钎料及其接合部性能测试的工业标准,由日本焊接协会提出初始提案,经日本工业标准调查会审议,最终由日本经济产业省于2003年6月20日并发布.标准涵盖了无铅钎料熔化温度范围测试、机械特性测试、铺展性测试、润湿性测试、接头的拉伸与剪切强度测试、QFP引线软钎焊接头拉引测试、片式元件软钎焊接头的剪切测试7个方面.依据JIS Z 3198 1-7原文对该标准各部分进行介绍,拟推进我国电子封装与组装的无铅化进程.
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| 关 键 词： | 无铅钎料 标准 接头性能 |
| 文章编号： | 1001-3474(2004)02-0047-08 |
| 修稿时间： | 2004年1月7日 |
Review of JIS Z 3198:Test Method for Lead-free Solders |
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| WANG Chun-qing,LI Ming-yu,TIAN Yan-hong,KONG Ling-chao.Review of JIS Z 3198:Test Method for Lead-free Solders[J].Electronics Process Technology,2004,25(2):47-54. |
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| Authors: | WANG Chun-qing LI Ming-yu TIAN Yan-hong KONG Ling-chao |
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| Abstract: | JIS Z 3198 is an industry standard about test method for lead-free solders and their joints.This standard was proposed initially by Welding Society of Japan,and reviewed by Council of Japan Industry Standard. Finally,the standard was determined by Japan Industry and Economy Ministry and released at 20 June,2003.The standard consists of seven sections such as test method for melting temperature range of lead-free solders,test method for mechanical properties,test method for spreading characteristics,test method for wetting characteristics,test method for tensile and shear strength of solder joints, test method for tensile properties of QFP solder joints,and test method for shear properties of solder joints of sliced devices.Present the contents of every section of the standard according to the original JIS Z 3198 1-7.The purpose is to improve the lead-free process in electronic package and assembly in China. |
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| Keywords: | Lead-free solder Standard Performance of joint |
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