| 微系统与中规模器件的封装技术设计 |
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| 引用本文： | 杨建生.微系统与中规模器件的封装技术设计[J].电子与封装,2011,11(5):5-9. |
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| 作者姓名： | 杨建生 |
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| 作者单位： | 天水华天科技股份有限公司; |
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| 摘 要： | 文章主要论述了微机电系统(MEMS)和微系统诸如微传感器、驱动器和微流体元件的电机封装技术、封装等级和封装技术相关的问题.首先陈述并讨论了典型的MEMS产品诸如微压传感器、加速度计和微泵;微电子封装和微系统封装技术,重点阐述芯片级封装技术和器件级封装技术问题.芯片级封装技术主要涉及芯片钝化、芯片隔离和芯片压焊;器件级封...
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| 关 键 词： | 电机封装 MEMS 微系统 封装问题 封装等级 |
Packaging Design of Microsystems and Meso-scale Devices |
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| YANG Jian-sheng.Packaging Design of Microsystems and Meso-scale Devices[J].Electronics & Packaging,2011,11(5):5-9. |
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| Authors: | YANG Jian-sheng |
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| Affiliation: | YANG Jian-sheng(Tianshui Huatian Technology Co.,Ltd.,Tianshui 741000,China) |
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| Abstract: | This paper will present an overview on electromechanical packaging of microelectromechanical systems(MEMS) and Microsystems such as microsensors,actuators,and fluidics.Technical problems,packaging levels and major issues related to packaging design will also be presented and discussed.Technical problems and packaging levels mainly include die level packaging and device level packaging.Die passivation,die isolation and die bonding are stated in die level packaging,signal transduction,wire bonding and compone... |
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| Keywords: | electromechanical packaging MEMS microsystems packaging issues packaging levels |
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