| 晶圆减薄机的研发及应用现状 |
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| 引用本文： | 张文斌.晶圆减薄机的研发及应用现状[J].电子工业专用设备,2011,40(9):25-27. |
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| 作者姓名： | 张文斌 |
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| 作者单位： | 北京中电科电子装备有限公司,北京,100176 |
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| 摘 要： | 介绍了硅片超精密磨削加工工艺的原理和特点,报告了国内外硅片超精密磨削技术与装备的研究与应用现状,强调了我国开展大直径硅片超精密磨削技术和装备研究的必要性。
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| 关 键 词： | 硅片 磨削 减薄机 |
The Development and Status of Back Thinning Machine |
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| ZHANG Wenbin.The Development and Status of Back Thinning Machine[J].Equipment for Electronic Products Marufacturing,2011,40(9):25-27. |
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| Authors: | ZHANG Wenbin |
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| Affiliation: | ZHANG Wenbin (CETC Beijing Electronic Equipment Co.,LTD,Beijing 100176) |
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| Abstract: | In this paper,the principle and characteristics of ultra precision grinding technologies used in IC manufacturing process are introduced,the present status and perspectives of the advanced grinding technologies and equipments applied wafer processing and backside thinning are reported,and the necessity and importance of researching and developing advanced grinding technology and equipment for large diameter wafers in our country is emphasized. |
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| Keywords: | Silicon wafer Grinding Grinding machine |
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