| 300mm硅片化学机械抛光压力控制技术研究 |
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| 引用本文： | 王东辉,郭强生,柳滨,陈威,王伟.300mm硅片化学机械抛光压力控制技术研究[J].电子工业专用设备,2011,40(8):1-4,37. |
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| 作者姓名： | 王东辉 郭强生 柳滨 陈威 王伟 |
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| 作者单位： | 中国电子科技集团公司第四十五研究所,北京,101601 |
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| 摘 要： | 介绍了一种应用于硅片化学机械抛光(CMP)设备的压力控制技术,综合利用在线检测方法和离线检测方法,借助于Matlab数值分析软件分析抛光主轴压力设定值、气缸气压值、传感器示值以及检测仪器测试值之间的关系,并建立了主轴压力闭环控制系统,达到精确控制主轴压力的目的。工艺实验证明,主轴压力闭环控制系统稳定、可靠、精确。
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| 关 键 词： | 化学机械抛光 压力检测 数据处理 闭环控制 |
Study on Pressure Control Technology of 300mm Prime Wafer CMP |
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| Wang Donghui,Guo Qiangsheng,Liu Bin,Chen Wei,Wang Wei.Study on Pressure Control Technology of 300mm Prime Wafer CMP[J].Equipment for Electronic Products Marufacturing,2011,40(8):1-4,37. |
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| Authors: | Wang Donghui Guo Qiangsheng Liu Bin Chen Wei Wang Wei |
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| Affiliation: | (The 45th Research Institute of CETC,Beijing 065201,China) |
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| Abstract: | This paper introduces a pressure control technology which is applied to 300mm prime wafer chemical mechanical polishing（CMP） equipment.Utilizing the method of online detection and offline detection,the relationship among the value of polishing spindle pressure,cylinder pressure,spindle sensor and testing instrument is analyzed by using the Matlab numerical analysis software.Then the closed-loop control system of spindle pressure is established.The objective of controlling spindle pressure accurately is achieved.The technical experiment proved that the closed-loop control system of spindle pressure is steady,reliable and accurate. |
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| Keywords: | CMP Pressure Detection Data Processing Closed-loop Control |
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