竹炭/酚醛树脂复合导电材料的制备与性能

以碳化温度为900 ℃的竹炭为导电骨料、 酚醛树脂为黏结剂、 炭黑为添加剂, 采用模压成型法制备竹炭/酚醛树脂复合导电材料。考察了竹炭的粒度、 酚醛树脂用量、 炭黑用量、 成型压力及固化温度等工艺因素对竹炭/酚醛树脂复合导电材料导电性和抗弯强度的影响。结果表明: 随着酚醛树脂用量的增加, 复合材料的抗弯强度增大, 电导率先增大后减小; 增加成型压力可同时提高复合材料的电导率和抗弯强度; 增大竹炭粉粒的粒径、 增加炭黑用量、 提高固化温度有利于改善复合材料的导电性, 但会不同程度地改变复合材料的力学性能。制备竹炭/酚醛树脂复合导电材料的最佳工艺条件为: 竹炭粒度≤75 μm, 树脂用量30%, 炭黑用量7.5%, 成型压力280 MPa, 固化温度180 ℃。 

Preparation and properties of bamboo charcoal/phenolic resin conductive composite

The bamboo charcoal/phenolic resin conductive composite were prepared by compression molding technology, using bamboo charcoal carbonized at 900 ℃ as the conductive fillers, resin as the binder and carbon black as the additive. The influences of the particle size, resin content, carbon black content, molding pressure and curing temperature on the properties of the composite were investigated. The results show that the flexural strength of the composite increases as the content of phenolic resin increases, and the conductivity of the composite at first increases and then decreases sharply with increasing of the resin content. Increasing molding pressure can improve the conductivity and flexural strength of composite simultaneously. It is beneficial to improve the conductivity of composite by increasing the particle size of bamboo charcoal, black content and curing temperature, but the flexural strength of the composite changes. The optimum particle size, resin content, carbon black content, molding pressure and curing temperature should be ≤75 μm, 30%, 7.5%, 280 MPa and 180 ℃, respectively.