| 锡镍合金电镀工艺的研究 |
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| 引用本文： | 冯辉.锡镍合金电镀工艺的研究[J].郑州大学学报(工学版),1990(2). |
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| 作者姓名： | 冯辉 |
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| 作者单位： | 郑州轻工业学院 |
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| 摘 要： | 本文以电化学方法对氟化物体系电镀锡镍合金的工艺进行了研究,从实践中发现使用添加剂T时,可使工艺的oH值范围从4.2—4.5增宽为3.8—5. 同时还发现镀液中含锡量大小对镀层质量也有显著影响.通过大量试验,确定了该工艺的最佳配方及工艺条件.
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| 关 键 词： | 锡镍 电镀 |
Study of Tin--Nickel Alloy Plating Technology |
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| Fcng Hui ZhengZhou Light Industrial College.Study of Tin--Nickel Alloy Plating Technology[J].Journal of Zhengzhou University: Eng Sci,1990(2). |
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| Authors: | Fcng Hui ZhengZhou Light Industrial College |
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| Affiliation: | Fcng Hui ZhengZhou Light Industrial College |
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| Abstract: | This paper has studied technology of the Tin-Nickel alloy plating of F system: From experiments we found that the pH range of the technology may be extended from 4.2-4.5 to 3.8-5 when used additive T, at the same time and that stannous tin content of the electrolyte have influenced on quality of coating obviously. |
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| Keywords: | Tin--Niekel plating |
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