| 微波多层电路过孔散射参数测量方法 |
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| 引用本文： | 田雨,童玲.微波多层电路过孔散射参数测量方法[J].电子测量与仪器学报,2010,24(6):555-560. |
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| 作者姓名： | 田雨 童玲 |
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| 作者单位： | 电子科技大学自动化工程学院,成都,611731 |
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| 基金项目： | 电子测试技术国家重点实验室基础研究基金 |
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| 摘 要： | 过孔属于典型三维不连续结构,是微波多层电路层间互连的重要形式。通过测量获得过孔结构的散射参数是验证相应理论分析和设计方法必不可少的环节。文中提出一种测量过孔散射参数的方法,通过对被测过孔结构的二次加工和夹具的特殊设计,解决了被测件与夹具的连接问题,并且使用移动测量参考面的方法实现了校准件设计和后期测量结果去嵌入的处理。加工测量的频段从10MHz~20GHz,从实际测量与软件仿真结果的对比可以看出,测量连接和夹具的影响已被去除,得到了更准确的反映过孔特性的测量结果。
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| 关 键 词： | 过孔 微波多层电路 散射参数 去嵌入 |
Measurement method of scattering parameters for via holes in microwave multilayer circuits |
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| Tian Yu,Tong Ling.Measurement method of scattering parameters for via holes in microwave multilayer circuits[J].Journal of Electronic Measurement and Instrument,2010,24(6):555-560. |
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| Authors: | Tian Yu Tong Ling |
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| Affiliation: | Tian Yu Tong Ling (School of Automation Engineering,University of Electronic Science and Technology of China,Chengdu 611731,China) |
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| Abstract: | Via holes are typical three-dimensional discontinuous structures and important interconnection forms among different layers in microwave multilayer circuits. So the scattering parameter of via-holes acquired by measurement is the key step in order to verify the corresponding theoretical analysis and design. The measurement method for the scattering parameter of via-holes is presented in the paper. The test connection problems can be solved by secondary processing for via holes under test and the special des... |
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| Keywords: | via holes microwave multilayer circuits scattering parameter de-embedding |
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