挠性基板制造工艺

应用于IC封装(Integrated Circuit,集成电路)的FPC(Flexible Printing Circuit,挠性印制板)称为挠性基板。随着电子产品向高密度、小型化、高可靠性方向发展,挠性基板线路制造工艺也从传统的减成法发展到半加成法,同时,一些新型的薄型挠性基板及埋嵌器件挠性基板也逐渐应用于航天、医疗及消费类电子等领域[1]。

Manufacturing engineering of flexible substrate

Flexible substrate is flexible printing circuit（FPC） board applied in integrated circuit package.With the high-density, smaller-size and high-reliability electronics becoming more popular, semi-additive process other than traditional tenting process is now more widely used in pattern production of flexible substrate. Some new type flexible substrates such as ultra thin flexible substrates and embedded flexible substrates have been widely aoolied in many fields such as aerospace, medical, automotive and consumer electronics.