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纳米AlN颗粒增强铜基复合材料的组织与性能研究
引用本文:王涂根,吴玉程,王文芳,张建华.纳米AlN颗粒增强铜基复合材料的组织与性能研究[J].粉末冶金工业,2005,15(4):21-24.
作者姓名:王涂根  吴玉程  王文芳  张建华
作者单位:合肥工业大学,材料学院,合肥,230009
基金项目:安徽省科技攻关项目;安徽省合肥市科研项目
摘    要:用粉末冶金法制备了AlN增强的Cu/AlN复合材料,研究了AlN含量对复合材料性能的影响和Cu/AlN复合材料的软化温度特性。结果表明,在烧结过程中,弥散分布在铜基体中的纳米AlN颗粒对致密化以及晶粒长大都有阻碍作用。随着复合材料中AlN颗粒质量分数的增加,材料的密度和导电性呈下降趋势,而硬度出现极大值。复合材料的软化温度达到700℃,远远高于纯铜的软化温度(150℃),从而提高了材料的热稳定性。

关 键 词:粉末冶金  复合材料  导电性  硬度  软化温度
文章编号:1006-6543(2005)04-0021-04
修稿时间:2005年1月10日

INVESTIGATION ON MICROSTRUCTURE AND PROPERTIES OF Cu - MATRIX COMPOSITE REINFORCED BY NANO - AlN PARTICLE
WANG Tu-gen,WU Yu-cheng,WANG Wen-fang,ZHANG Jian-hua.INVESTIGATION ON MICROSTRUCTURE AND PROPERTIES OF Cu - MATRIX COMPOSITE REINFORCED BY NANO - AlN PARTICLE[J].Powder Metallurgy Industry,2005,15(4):21-24.
Authors:WANG Tu-gen  WU Yu-cheng  WANG Wen-fang  ZHANG Jian-hua
Abstract:The AlN particles reinforced Cu/AlN composites was produced by powder metallurgy method.The influence of AlN content on properties and softening temperature of Cu/AlN composite were studied.The results showed that nano-AlN particles dispersed in copper matrix can preclude the copper grains from growing cluring sintering.With increase of AlN content,both the density and conductivity of composite are reduced,whereas the hardness is increased.The softening temperature of the Cu/AlN composite is at about 700 which is far higher than that of pure copper,leading to improvement of temperature stability.
Keywords:Cu/AlN
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